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About Us

Chipwise provides Semiconductor Intelligence based on physical analysis, teardown analysis and Reverse Engineering

Contact Info

  • De Veldmaat 17
  • 7522 NM
  • Enschede
  • The Netherlands
  • info@chipwise.tech
  • +31537113618
Competitor Analysis

Reverse Engineering & Teardown

Whether it is for Market Research or Patent Infringement evidence. Chipwise helps you getting the data you require...

Material Analysis

Semiconductor Insights

Technology analysis providing Semiconductor Intelligence for R&D departments, Research Institutes, Quality Control or IP solutions...

Semiconductor Insights

Deep insights analysis

Material Analysis
What is it made of? What does it contain?
Patent Infringement analysis
Semiconductor IP analysis
Chip circuit edit
Physically change your chip's circuitry using FIB deposition and cuts
Teardown analysis
Have a look inside today's advanced technology
Get in contact
Have a request?...Mail us anytime
info@chipwise.tech
our Services

What are we good at?

Competitor Analysis

Competitor Analysis

Know your competitor! For strategic planning it is crucial to identify opportunities and threats caused by your competitors.
Reverse Engineering

Reverse Engineering

We'll open up the device and have a look inside and report you all the required data..
Die shot analysis

Die shot analysis

Extracting the silicon chip out of the device and achieve High Resolution stitched floorplan image of the die.
Analysis Techniques

What techniques do we use?

FIB Cross sectioning

Site-specific cross section using Focussed Ion Beam FIB i.c.w. Scanning Electron Microscopy SEM

Chip Deprocessing

Layer by layer planar lapping of the chip i.c.w. Optical Microscopy or SEM

Material Analysis

Energy Dispersive X-rays Spectroscopy EDX or EDS to get material insights
Microscopy
Optical Microscopy as well as Electron Microscope are both key in Physical Analysis investigations
Portfolio

What we're working on