our Services
What are we good at?
Competitor Analysis
Competitor Analysis
Know your competitor! For strategic planning it is crucial to identify opportunities and threats caused by your competitors.
Reverse Engineering
Reverse Engineering
We'll open up the device and have a look inside and report you all the required data..
Die shot analysis
Die shot analysis
Extracting the silicon chip out of the device and achieve High Resolution stitched floorplan image of the die.
Analysis Techniques
What techniques do we use?
FIB Cross sectioning
Site-specific cross section using Focussed Ion Beam FIB i.c.w. Scanning Electron Microscopy SEM
Chip Deprocessing
Layer by layer planar lapping of the chip i.c.w. Optical Microscopy or SEM
Material Analysis
Energy Dispersive X-rays Spectroscopy EDX or EDS to get material insights
Microscopy
Optical Microscopy as well as Electron Microscope are both key in Physical Analysis investigations
