After teardown of the electronic device we take out the chip of interest. Next step is to extract the die from its package using mechanical grinding and polishing in combination with wet chemical etching. This is followed up by High Magnitude Optical Microscopy to obtain a nice clear die shot of the frontside of the chip. This often is not sufficient to reveal the functional blocks of the chip. Therefor we remove all the bulk silicon to reveal its backside. Now all the functional blocks are clearly visible. Another High Resolution Optical Microscopy step is performed to get a die shot of the backside of the chip

• High Resolution Optical Floorplan images
• You can zoom in very deeply as if you're using the microscope yourself
• additional extreme high magnitude imaging can be performed if required