Apple recently launched their new iPhone range. We got our hands on the new iPhone 16 and 16 Pro smartphones. We took them apart and had a peak inside. This article only covers the die shots of the SoC’s. A separate article will show the iPhone 16 teardown analysis.

The A18 and A18 Pro chips from Apple are the latest generation of processors introduced in 2024, designed for high-performance in mobile devices and premium products. The A18 is the base version, while the A18 Pro offers enhanced power for top-tier devices like the iPhone Pro models and possibly future iPads or MacBooks. The packaging technique has remained consistent over the years, with TSMC utilizing the InFO-PoP (Integrated Fan-Out Package-on-Package) method. This approach stacks the DRAM package directly on top of the SoC die and incorporates high-density RDL (Redistribution Layers) along with TIV (Through InFO Via) to reduce the overall chip size while ensuring strong thermal and electrical performance. A key advantage of this technique is its flexibility, as the DRAM package can be easily swapped or replaced.

A18 Chip
The A18 chip is built on a more advanced architecture than its predecessors and uses an improved 3-nanometer (nm) manufacturing process (TSMC N3E). It features a 6-core CPU with a balanced architecture of two high-performance cores for demanding tasks and four high-efficiency cores for routine processes, ensuring optimal performance and power efficiency. It includes a 5-core GPU designed to deliver exceptional graphics performance for gaming, augmented reality, and high-resolution tasks while minimizing power consumption.