In September 2026 we performed a full teardown of the newly released iPhone 18 Pro, with a primary focus on the A20 Pro system-on-chip — Apple’s first 2 nm processor and the first smartphone SoC built on TSMC’s N2 Gate-All-Around (GAA) nanosheet process.

Our analysis covered:

• Complete disassembly and imaging of the iPhone 18 Pro internal components
• Detailed view of the Wafer-Level Multi-Chip Module package
• Package related cross section covering the motherboard PCB up to the SoC package. We stopped sectioning till right before A20 pro silicon to prevent damaging.
• Detailed examination of the A20 Pro die, packaging architecture (including the new side-by-side WMCM layout), and thermal solution
• High resolution Optical Microscopy (stitched) Die shot floorplan
• STEM cross section to reveal the layer stack, GAA nano sheets and Critical Dimensions

Why This Matters

The move to TSMC’s N2 node marks one of the most significant architectural transitions in mobile silicon in over a decade. By surrounding the channel on all four sides, GAA transistors deliver tighter electrostatic control, reduced leakage, and improved performance-per-watt. Our teardown work documents how Apple implemented this technology in a production smartphone, including die size, floorplan observations, packaging innovations, and thermal management strategies that support the chip’s higher sustained performance claims.

Whats in the full report

• Teardown optical images
• Images of the WMCM package
• PCB to RDL cross section optical images
• Solderball footprint
• High-resolution die and package photography
• Annotated Die shot
• Metal stack cross section details
• TSMC N2 Gate-All-Around Technical notes on the A20 Pro’s GAA implementation and system-level integration

As an example you can have a look at the full report of the Broadcom BCM2712

Feel free to get in contact in case you want to know more about the other chips used in the iPhone 18 Pro.