Chipwise has completed a full physical analysis of the Broadcom BCM2712 System-on-Chip used in the Raspberry Pi 5.
This report focuses on the cost-optimized D0 stepping, which was introduced in 2024. Compared with the earlier C0/C1 version, the die has been reduced from 55.3 mm² to 32.4 mm² — a shrink of approximately 41 % — by removing unused functional blocks (“dark silicon”).

Key findings include:

• TSMC 16 nm FinFET process confirmation
• 12 metal layers
• Detailed floorplan with functional block areas
• Critical dimensions extracted from FIB and STEM cross-sections
• SRAM type 1 capacity measurement (~5.9MB)
• Package and assembly analysis (including embedded cross-section)

See also Die shot analysis of the predecessor C0/C1 stepping 2022 here 

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