The Exynos 2600 represents Samsung’s push back into the flagship mobile processor space with cutting-edge process technology and architectural refinements. Fabricated on the 2nm GAA node, it promises better power efficiency, higher transistor density, and superior thermal behavior than the 3nm or 4nm nodes used in prior Exynos chips.

CPU Configuration

• Deca-core (10-core) setup using Arm C1 series cores (v9.3 architecture):
  • 1× C1-Ultra prime core @ up to 3.8 GHz
  • 3× C1-Pro performance cores @ up to 3.25 GHz
  • 6× C1-Pro cores @ up to 2.75 GHz
• Samsung claims up to 39% better CPU performance versus the Exynos 2500, with notable improvements in both single-threaded responsiveness and multi-core workloads.

GPU

• Samsung Xclipse 960 GPU — the first smartphone GPU built on a 2nm GAA process.
• Based on AMD’s RDNA 4 architecture.
• Supports hardware-accelerated ray tracing, Exynos Neural Super Sampling (ENSS) for AI-powered upscaling and frame generation, and delivers substantial graphics performance uplift (with reports of strong ray-tracing gains).

AI and NPU

• Dedicated AI engine with a 32K MAC NPU.
• Significantly enhanced on-device AI performance (Samsung highlights major leaps in generative AI and neural processing compared to previous generations).
• Features like Deep learning Video Noise Reduction (DVNR) for improved camera and video quality.

Memory, Storage, and Multimedia

• Supports LPDDR5X memory and UFS 4.1 storage.
• Display: Up to 4K/WQUXGA @ 120 Hz.
• Camera: Single camera up to 320 MP, 108 MP @ 30 fps, dual configurations supported.
• Video: 8K 30 fps encoding / 8K 60 fps decoding, with broad codec support including AV1, VP9, HEVC, and Samsung’s APV.

Key Innovations

• Heat Path Block (HPB) technology: Improves heat dissipation using advanced materials, enabling better sustained performance under load with lower peak temperatures.
• Overall efficiency gains in CPU and GPU perf/watt, making the SoC more competitive with leading rivals in real-world usage.

At ChipWise, we specialize in extracting the silicon die, creating high-resolution stitched floorplan images, and performing detailed physical analysis of advanced nodes like 2nm GAA. Our die shot analysis of the Exynos 2600 provides deep insights into transistor layout, core floorplanning, interconnects, and implementation of Samsung’s latest GAAFET structures — valuable for competitor benchmarking, IP validation, and semiconductor R&D. Would you like to see more details from our analysis? Contact us for custom teardown or reverse engineering requests.