IO chip of AMD Ryzen 7 5800 X3D

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Project Details

  • I/O chip Ryzen 7
  • AMD Ryzen 7 5800 X3D
  • Chip cross section
  • July, 2022

AMD Ryzen 7 5800 X3D IO chip

The AMD Ryzen 7 5800X3D is a unique high-performance CPU, first released in early 2022. It’s notable for being the first consumer processor to feature AMD’s 3D V-Cache technology, which significantly boosts its gaming performance. Its CPU is based on the AMD Zen3 architecture. As mentioned it standout feature is the 3D V-Cache, which stacks an additional 64MB of L3 cache on top of the chip’s existing cache. The Zen 3 CPU is build on TSMC’s 7 nm proces node. For connectivity the 5800 X3D uses a separate 123mm2 IO die build on a 12 nm proces node probably GlobalFoundries. This article is about this I/O die. The metal stack involves 13 metal layers made of copper.

 

FIB cross section of Ryzen 7 5800 IO chip
FIB cross sectional view 14 nm proces node

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