Project Details Project Name:MediaTek Dimensity 9300 Device:ViVO X100 Category:Die shot Project Year:December, 2023 MediaTek Dimensity 9300 The MediaTek Dimensity 9300 is a high-performance mobile chip that incorporates an advanced hardware configuration with a focus on AI and gaming efficiency. It…

Project Details Project Name:Snapdragon X Elite Device:Microsoft Surface Laptop Copilot+ PC 15 Category:Die shot Project Year:June, 2024 Qualcomm Snapdragon X Elite chip analysis The Snapdragon X Elite is Qualcomm's high-performance chip designed for laptops and Windows-based devices, marking the company's…

Project Details Project Name:Snapdragon 8 gen 3 Device:Xiaomi 14 Category:Die shot Project Year:December, 2023 Qualcomm Snapdragon 8 gen 3 chip analysis The Snapdragon 8 Gen 3 is Qualcomm's flagship mobile chipset, designed to power premium smartphones with cutting-edge performance and…

Project Details Project Name:MediaTek Dimensity 930 Device:Motorola G73 Category:Die shot Project Year:June, 2023 MediaTek Dimensity 930 The MediaTek Dimensity 930 is a mid-range mobile chipset designed to deliver a balance of performance, power efficiency, and enhanced connectivity for smartphones. Built…

Project Details Project Name:Apple A17 Pro Device:iPhone 15 Pro Category:Die shot Date:January 2024 Apple A17 Pro die shot The A17 Pro chip, developed by Apple, is a cutting-edge system-on-chip (SoC) designed to power the company's mobile devices, such as the…

Project Details Project Name:Samsung Exynos 2400 Device:Samsung Galaxy S24 Category:Die shot Project Year:January, 2024 Samsung Exynos 2400 SoC chip analysis The Exynos 2400 System on Chip (SoC) represents a significant leap in mobile processing power and efficiency. Engineered by Samsung,…

Broadcom BCM2712 die shot Project Details Project Name:Broadcom BCM2712 SoC Device:Raspberry Pi 5 Category:Die shot Project Year:March, 2024 Broadcomm BCM2712 SoC The Broadcom 2712 System on Chip (SoC) marks a significant advancement in the Raspberry Pi lineup, powering the fifth…