At Chipwise, we specialize in high-resolution cross-sectional imaging and precision sample preparation to uncover the nanoscale structures powering today’s cutting-edge logic and memory chips. Leveraging advanced focused ion beam (FIB) milling paired with high-resolution scanning transmission electron microscopy (STEM), we…
Recently, we conducted a detailed physical analysis on a DRAM memory chip to map out the precise dimensions and structural features corresponding to a specific process node. The device in question was an SK hynix LPDDR5X-10667 module, fabricated using the 1b…
Project Details Project Name:I/O chip Ryzen 7 Device:AMD Ryzen 7 5800 X3D Category:Chip cross section Project Year:July, 2022 AMD Ryzen 7 5800 X3D IO chip The AMD Ryzen 7 5800X3D is a unique high-performance CPU, first released in early 2022.…